Aperture-Coupled Patch Antenna Designs for 60-GHz Package Applications Duixian Liu, PhD IBM Thomas J. Watson Research Center
Abstract: There is an increasing demand for low-cost wireless communication systems that operate in the 60 GHz band to support Gbps data rates. Typical applications demanding Gbps data rates include wireless gigabit Ethernet and wireless uncompressed high-definition video. Recent advances in silicon technologies have enabled single chip solutions, making the 60 GHz technology more commercially attractive. However, for the 60 GHz market to flourish, not only are low-cost devices solutions required, but also low-cost antenna and packaging solutions. The short wavelength at 60 GHz allows antennas to be embedded within a package or integrated on a chip. Antenna-in-package solutions have been recognized to have advantages over antenna-on-chip solutions in bandwidth and radiation efficiency. The realization of a robust, efficient and broadband 60 GHz antenna within a multilayer organic (MLO) or LTCC package is challenging due to assembly difficulties, material selection, and manufacturing tolerances. The proposed superstrate aperture-coupled patch antenna structures provide both wide bandwidth and high efficiency. Two types of packages with integrated antennas have been designed. In the first case, the package has an open cavity for housing the RFIC chip. The advantage of this design is easy antenna feed line layout and low loss. This design is suitable for MLO packages. In the second case, the RFIC chip is attached to the bottom of the package. This design is relatively easier to manufacture and more flexible to layout than the first case and suitable for LTCC packages. Both types of packages have been designed, prototyped and evaluated. More importantly, they have been used in our 60 GHz 16-element phased array applications.
Bio: Duixian Liu received the B.S. degree in electrical engineering from XiDian University, Xi'an, China, in 1982, and the M.S. and Ph.D. degrees in electrical engineering from the Ohio State University, Columbus, in 1986 and 1990, respectively.
From 1990 to 1996, he was with Valor Enterprises Inc. Piqua, Ohio, initially as an Electrical Engineer and then as the Chief Engineer, during which time he designed an antenna product line ranging from 3 MHz to 2.4 GHz for the company, a very important factor for the prestigious Presidential "E" Award for Excellence in Exporting in 1994. Since April 1996, he has been with the IBM T. J. Watson Research Center, Yorktown Heights, NY, as a Research Staff Member. He has received three IBM's Outstanding Technical Achievement Awards and one Corporate Award, the IBM's highest technical award. He was named Master Inventor in 2007. He has edited a book titled Advanced Millimeter-wave Technologies - Antennas, Packaging and Circuits published in 2009 by Wiley. He has authored or coauthored more than 100 journal and conference papers. He has 40 patents issued and 20 patents pending. His research interests are antenna design, EM modeling, chip packaging, digital signal processing, and communications technologies.
Dr. Liu is a Fellow of IEEE and an associate editor for the IEEE Transactions on Antennas and Propagation and a Guest Editor for the IEEE Transactions on Antennas & Propagation special issues on Antennas and Propagation Aspects of 60-90 GHz Wireless Communications (October 2009) and upcomimg Antennas and Propagation at mm- and sub mm-waves (April 2013). He has been an organizer or chair for numerous international conference sessions or special sessions and served as a technical program committee member for many international conferences. He was the general chair of the 2006 IEEE International Workshop on Antenna Technology: Small Antennas and Novel Metamaterials, White Plains, New York. He has served as an external Ph.D. examiner for several universities and external examiner for government organizations on research grants.
This talk is sponsored by the "Joint IEEE Chapter of Antennas and Propagation Society, Geoscience and Remote Sensing Society, and Photonic Society at Central Illinois"